Electronic Systems Assembler Micro C - 2nd shift (Wire bonding)
ES/079866
Rolling Meadows, IL (Chicago Area)
Northrop Grumman

Performs Microelectronics assembly operations utilizing a variety of equipment and hand tooling. Experience in auto and manual wirebonding is required. The position demands a high degree of precision, and the ability to work from written instructions, engineering drawings, and visual aids. Assigned tasks will routinely be performed under a microscope. Basic computer skills and the successful completion of our in-house Microelectronics Criteria Training class are required. Prior experience with Component or Substrate Attach is a plus. Educational requirements: High School and one year experience or Associates degree and no experience.
Northrop Grumman Corporation is a global defense company headquartered in Los Angeles, California and operating in all 50 states. The U.S. and international military, government and commercial customers depend on our innovative products and solutions. Working at Northrop Grumman means making a direct contribution to projects that keep our homeland safe, expanding the boundaries of possibility and reshaping the world we live in. More details and information available at http://careers.northropgrumman.com/

Apply:
For faster processing, please apply online and directly to the employer. Specific instructions on how to apply are available. (recommended)